Electrolytic solution supply and recovery facility and liquid component replenishment apparatus

ABSTRACT

There is provided an electrolytic solution supply and recovery facility which, in response to an increase in the production amount of an associated electrolytic processing apparatus, can efficiently supply and recover an electrolytic solution while enhancing the productivity and lowering the production cost. An electrolytic solution supply and recovery facility for supplying and recovering an electrolytic solution to and from an electrolytic processing apparatus, includes: a fresh liquid supply section for storing a fresh electrolytic solution, said electrolytic solution having been transferred from a carry-in container that has been carried in from the outside, and for supplying the fresh electrolytic solution to the electrolytic processing apparatus; and a waste liquid recovery section for recovering the electrolytic solution from the electrolytic processing apparatus, storing the electrolytic solution and transferring the electrolytic solution to a carry-out container which is to be carried to the outside.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to an electrolytic solution supplyand recovery facility and a liquid component replenishment apparatus,and more particularly to an electrolytic solution supply and recoveryfacility useful for supplying and recovering an electrolytic solution toand from an electrolytic processing apparatus, such as an electroplatingapparatus for forming a film of an interconnect material, such ascopper, on the surface of a substrate having fine interconnect patterns(recesses) or an electrolytic etching apparatus for etching and removinga metal film formed in a surface of a substrate, and a liquid componentreplenishment apparatus associated with the electrolytic solution supplyand recovery facility.

[0003] 2. Description of the Related Art

[0004]FIG. 8 shows a conventional common construction of anelectroplating system which includes an electroplating apparatus as anelectrolytic processing apparatus, and a plating solution (electrolyticsolution) supply and recovery facility, and which is used, for example,for the production of copper interconnects by plating. Theelectroplating system includes a rectangular electroplating apparatus(main apparatus) 12 and transport boxes 10 such as SMIF boxes,detachably mounted to the electroplating apparatus 12, each housing anumber of substrates, such as semiconductor wafers. The electroplatingapparatus 12 includes a stage 14, four electroplating units 16 and twocleaning units 18. The electroplating apparatus 12 is also provided witha first transport robot 20 as a transport device for transporting asubstrate between one of the transport boxes 10 and the stage 14, and asecond transport robot 22 as a transport device for transporting thesubstrate between the stage 14, one of the electroplating units 16 andone of the cleaning units 18.

[0005] In operation, one substrate is taken by the first transport robot20 out of the transport box 10 housing substrates, and is placed on thestage 14. The substrate placed on the stage 14 is transported by thesecond transport robot 22 to one of the electroplating units 16, whereelectroplating, such as copper plating, of the substrate is carried out.The substrate after plating is transported by the second transport robot22 to one of the cleaning units 18, where post-cleaning of the substrateand the subsequent spin-drying are carried out. The substrate afterspin-drying is transported by the second transport robot 22 to the stage14 and placed on the stage 14. The substrate placed on the stage 14 isthen returned by the first transport robot 20 to the original positionwithin the transport box 10.

[0006] In the electroplating apparatus 12 is installed a reservoir(intermediary plating solution tank) 24 for storing a plating solutionand supplying the plating solution to each electroplating unit 16 in acirculatory manner, and a liquid component replenishment apparatus 26for replenishing a deficient chemical component in the plating solutionin the reservoir 24. Further, the electroplating apparatus 12 isequipped with a plating solution analyzer 28 for sampling and analyzingthe plating solution in the reservoir 24. The plating solution in thereservoir 24 is sampled and analyzed by the plating solution analyzer28. Based on the analytical results, a necessary chemical component issupplied (added) to the plating solution from the liquid componentreplenishment apparatus 26.

[0007] On the other hand, a plating solution supply and recoveryfacility 30 is provided adjacent to the electroplating apparatus 12. Theplating solution supply and recovery facility 30 includes a carry-incontainer 32, such as a fresh liquid drum, which holds a fresh platingsolution (fresh liquid) and is carried in from the outside, and acarry-out container 34, such as a waste liquid drum, which recovers andholds the used plating solution (waste liquid) and is carried to theoutside. The carry-in container (fresh liquid drum) 32 and the reservoir24 are connected by a plating solution supply line 36, and the carry-outcontainer (waste liquid drum) 34 and the reservoir 24 are connected by aplating solution discharge line 38, so that the fresh plating solutionheld in the carry-in container 32, which has been carried in from theoutside, is supplied to the reservoir 24 while the used plating solution(waste liquid) in the reservoir 24 is recovered and carried out to theoutside by the carry-out container 34.

[0008] A so-called base bath (in the case of a copper sulfate platingsolution, a mixture of inorganic components, such as copper sulfate,sulfuric acid, hydrochloric acid and water) is often used as the platingsolution supplied as a fresh liquid. A chemical component(s), forexample an additive (in the case of a copper sulfate plating solution,suppressor, accelerator and/or inhibitor), is supplied (added) from theliquid component replenishment apparatus 26 to the plating solution inthe reservoir 24, according to necessity. Electrochemical analysis,chemical titration analysis, liquid chromatography, etc. are generallyutilized for analysis by the plating solution analyzer 28.

[0009] When the number of the electroplating apparatuses 12 isrelatively small, it is generally practiced to arrange theelectroplating apparatuses 12, each provided with one plating solutionsupply and recovery facility 30, as shown in FIG. 8, in parallel.Further, because of a relatively small amount of liquid, a drum of avolume of about 200 L or a plastic container of about 20 L is commonlyused as the carry-in container 32 for the supply of fresh liquid and asthe carry-out container 34 for the discharge of waste liquid. A changeof the drum or container is generally practiced by hand.

[0010] With such a conventional plating solution supply and recoveryfacility, however, supply and recovery of a plating solution cannotalways be carried out efficiently, for example, when the productionamount of e.g. a substrate is considerably increased. For example, afresh liquid drum, when the fresh liquid in the drum is used up, needsto be promptly changed for a new one. When a signal requesting supply ofthe fresh liquid is outputted from the main plating apparatus duringplating after a fresh liquid drum becomes empty, the apparatus must bestopped for a change of the drum in order to respond to the request.Likewise, when a discharge drum is filled up, the apparatus must bestopped for a change of the drum for an empty drum to respond to a wasteliquid request signal. Such a stop of the apparatus for a change of drumlowers the operating rate of the apparatus, leading to an increase inthe production cost.

[0011] Further, when the number of electroplating apparatuses isincreased to meet an increased production amount, the number of drums tobe changed also increases accordingly, necessitating frequent changes ofdrums. In addition, the worker must be engaged in the simple work ofdrum change for a longer time, which increases the labor cost and thusthe production cost. Furthermore, moving such a heavy thing as a 200 Ldrum by hand is a dangerous work, and thus is undesirable in the lightof safety.

[0012] While the conventional electroplating apparatus for performingelectroplating using, as an electrolytic solution, a plating solutionhas been described hereinabove, the above situation is the same withetching apparatuses which perform the reverse process to plating, usingas an electrolytic solution an etching liquid.

SUMMARY OF THE INVENTION

[0013] The present invention has been made in view of the abovesituation in the related art. It is therefore an object of the presentinvention to provide an electrolytic solution supply and recoveryfacility which, in response to an increase in the production amount ofan associated electrolytic processing apparatus, can efficiently supplyand recover an electrolytic solution while enhancing the productivityand lowering the production cost, and a liquid component replenishmentapparatus associated with the electrolytic solution supply and recoveryfacility.

[0014] In order to achieve the above object, the present inventionprovides an electrolytic solution supply and recovery facility forsupplying and recovering an electrolytic solution to and from anelectrolytic processing apparatus, comprising: a fresh liquid supplysection for storing a fresh electrolytic solution, said electrolyticsolution having been transferred from a carry-in container that has beencarried in from the outside, and for supplying the fresh electrolyticsolution to the electrolytic processing apparatus; and a waste liquidrecovery section for recovering the electrolytic solution from theelectrolytic processing apparatus, storing the electrolytic solution andtransferring the electrolytic solution to a carry-out container which isto be carried to the outside.

[0015] According to the electrolytic solution supply and recoveryfacility, even when the carry-in container, such as a fresh liquid drum,holding a fresh electrolytic solution becomes empty, or when thecarry-out container, such as a waste liquid drum, is filled up, a freshelectrolytic solution (fresh liquid) can be supplied from the freshliquid supply section to the electrolytic processing apparatus, or theused electrolytic solution (waste liquid) from the electrolyticprocessing apparatus can be recovered in the waste liquid recoverysection. This enables a change of the carry-in container (fresh liquiddrum) or the carry-out container (waste liquid drum) without a stop ofthe apparatus.

[0016] The electrolytic solution supply and recovery facility mayfurther comprise a liquid component replenishment apparatus forreplenishing the electrolytic solution in the fresh liquid supplysection with a predetermined chemical component.

[0017] When using a so-called base bath as a fresh electrolytic solutionto be supplied from the carry-in container, an additive can be supplied(added) from the liquid component replenishment apparatus to the basebath in the fresh liquid supply section to prepare an electrolyticsolution having a predetermined (desired) composition so that thedesired electrolytic solution can be supplied to the electrolyticprocessing apparatus.

[0018] The present invention also provides an electrolytic solutionsupply and recovery facility for supplying and recovering anelectrolytic solution to and from a plurality of electrolytic processingapparatuses, comprising: a fresh liquid storage section for storing afresh electrolytic solution which has been carried in from the outside;a fresh liquid supply section for storing the fresh electrolyticsolution which has been transferred from the fresh liquid storagesection and supplying the fresh liquid to each of the plurality ofelectrolytic processing apparatuses; a waste liquid recovery section forrecovering the electrolytic solution from each of the plurality ofelectrolytic processing apparatuses and storing the electrolyticsolution, and a waste liquid storage section for storing theelectrolytic solution which has been transferred from the waste liquidrecovery section and is to be carried to the outside.

[0019] This electrolytic solution supply and recovery facility canrespond to an increase in the production amount of e.g. a substrate byincreasing the number of electrolytic processing apparatuses. Further,this facility can avoid the need to stop the apparatuses and enablesmass carrying-in and mass carrying-out of an electrolytic solution bye.g. a tanker. This reduces the workload of the electrolytic solutionwhich must be consumed in a larger amount due to the increased number ofelectrolytic processing apparatuses.

[0020] In a preferred embodiment of the present invention, theelectrolytic solution circulates between the fresh liquid supply sectionand each of the plurality of electrolytic processing apparatuses.

[0021] This enables reuse of the electrolytic solution by recycling.

[0022] In a preferred embodiment of the present invention, the freshliquid storage section and the fresh liquid supply section are connectedby a line provided with a filter.

[0023] Particles contained in the electrolytic solution can be removedby the filter upon transfer of the electrolytic solution from the freshliquid storage section to the fresh liquid supply section. The line mayalso be provided with a vacuum deaeration unit in order to remove adissolved gas in an electrolytic solution. Particles and a gas can leadto the formation of a poor plated film, for example. Removal ofparticles and a gas is particularly effective for the production of anLSI.

[0024] In a preferred embodiment of the present invention, each of theplurality of electrolytic processing apparatuses is provided with anelectrolytic solution analyzer for analyzing a the electrolytic solutionwhich has been supplied to the electrolytic processing apparatus, and aliquid component replenishment apparatus for replenishing theelectrolytic solution with a chemical component based on the results ofanalysis by the electrolytic solution analyzer.

[0025] The present invention also provides a liquid componentreplenishment apparatus for metering a predetermined chemical componentand replenishing an electrolytic solution with the chemical component,comprising; a total amount metering device for metering the total amountof a supplementary chemical component stored in a storage container; anda dose metering device for metering a dose of the chemical component tobe transferred and supplied from the storage container to theelectrolytic solution.

[0026] A dose metering device may be used which has an appropriatemeasurement range that meets an amount (dose) of a chemical component tobe replenished (added). By precisely metering a small amount of chemicalcomponent (replenisher) with such a dose metering device and adding themetered amount of replenisher to an electrolytic solution, it becomespossible to supply (add) the chemical component in such an amount thatmeets the concentration accuracy requirement of e.g. within 0.5%, evenwhen the amount is very small, for example on the order of ppb to ppm.

[0027] The metering devices may employ a gravimetric method and/or avolumetric method.

BRIEF DESCRIPTION OF THE DRAWINGS

[0028]FIG. 1 is a schematic plan view of an electroplating system(electrolytic processing system) provided with a plating solution(electrolytic solution) supply and recovery facility according to anembodiment of the present invention;

[0029]FIG. 2 is a schematic plan view of an electroplating system(electrolytic processing system) provided with a plating solution(electrolytic solution) supply and recovery facility according toanother embodiment of the present invention;

[0030]FIG. 3 is a schematic plan view of a plating solution(electrolytic solution) supply and recovery facility according to yetanother embodiment of the present invention;

[0031]FIGS. 4A through 4C are schematic diagrams showing variousexamples of a liquid component replenishment section of a liquidcomponent replenishment apparatus;

[0032]FIG. 5 is a schematic plan view of an electroplating system(electrolytic processing system) provided with a plating solution(electrolytic solution) supply and recovery facility according to yetanother embodiment of the present invention;

[0033]FIG. 6 is a schematic plan view of an electroplating system(electrolytic processing system) provided with a plating solution(electrolytic solution) supply and recovery facility according to yetanother embodiment of the present invention;

[0034]FIG. 7 is a schematic plan view of an electroplating system(electrolytic processing system) provided with a plating solution(electrolytic solution) supply and recovery facility according to yetanother embodiment of the present invention; and

[0035]FIG. 8 is a schematic plan view of an electroplating systemprovided with a conventional plating solution supply and recoveryfacility.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0036] Preferred embodiments of the present invention will now bedescribed with reference to the drawings. Though the followingdescription is made of electroplating systems which, as with theconventional system shown in FIG. 8, use as an electrolytic solution aplating solution, the description holds true with electrolytic etchingsystems which use as an electrolytic solution an electrolytic etchingliquid. The same reference numerals as used for the conventional systemshown in FIG. 8 refer to the same or corresponding elements, and aduplication description thereof will be omitted.

[0037]FIG. 1 shows an electroplating system provided with a platingsolution supply and recovery facility according to an embodiment of thepresent invention. This electroplating system differs from theconventional system shown in FIG. 8 in the following respects.

[0038] The plating solution supply and recovery facility 40 of thisembodiment includes a fresh liquid supply section 42, for examplecomprised of a drum, connected via the plating solution supply line 36to the reservoir 24 disposed in the electroplating apparatus 12, and awaste liquid recovery section 44, for example comprised of a drum,connected via the plating solution discharge line 38 to the reservoir 24therein. The carry-in container 32, such as a fresh liquid drum, whichholds a fresh plating solution (fresh liquid) therein and has beencarried in from the outside, is connected via a plating solutionintroduction line 46 to the fresh liquid supply section 42 and set inthe plating solution supply and recovery facility 40. The carry-outcontainer 34, such as a waste liquid drum, which recovers and holds theused plating solution (waste liquid) therein and is to be carried to theoutside, is connected via a waste liquid introduction line 48 to thewaste liquid recovery section 44 and set in the plating solution supplyand recovery facility 40. The other construction is the same as theconventional system shown in FIG. 8.

[0039] According to this embodiment, the plating solution which has beensupplied to the reservoir 24 disposed in the electroplating apparatus(main apparatus) 12, is circulated between the reservoir 24 and each ofthe electroplating units 16 disposed in the electroplating apparatus 12.The plating solution is thus reused while recycling. The platingsolution supply and recovery facility 40 of this embodiment can preventa lowering of the operating rate of the apparatus due to changes of thecarry-in container 32 and the carry-out container 34, such as drums.

[0040] In particular, in regard to a fresh liquid (fresh platingsolution), the provision of the fresh liquid supply section 42, forexample comprised of a drum, separately from the carry-in container(fresh liquid drum) 32 makes it possible to supply a fresh liquid fromthe fresh liquid supply section 42 to the reservoir 24 even during thework of carrying in the carry-in container 32. Also with the wasteliquid, the provision of the waste liquid recovery section 44, forexample comprised of a drum, separately from the carry-out container(waste liquid drum) 34 makes it possible to recover the waste liquidfrom the reservoir 24 in the waste liquid recovery section 44 evenduring the work of carrying the carry-out container 34 out. Thus, theplating operation can be continued without a stop of the apparatus.

[0041]FIG. 2 shows an electroplating system provided with a platingsolution supply and recovery facility 40 a according to anotherembodiment of the present invention, which uses a plating solutionwithout replenishment of a component. The electroplating system of thisembodiment differs from the system shown in FIG. 1 in that the formersystem employs, as a fresh plating solution (fresh liquid) held in thecarry-in container (fresh liquid drum) 32, a plating solution comprisinga base bath premixed with a supplementary components, such as anadditive, thereby omitting the liquid component replenishment apparatus26 shown in FIG. 1. Instead of the liquid component replenishmentapparatus 26, a waste liquid relay section 50 for storing the usedplating solution (waste liquid) discharged from the electroplating unit16 is provided, and the waste liquid relay section 50 and the wasteliquid recovery section 44 are connected by the waste liquid dischargeline 38.

[0042] If the premixed plating solution held in the carry-in container32 is one which has undergone a reliable assay of the composition, thereis then no need for a check of the composition of the plating solutionby the plating solution analyzer 28. This, in addition to the omissionof the liquid component replenishment apparatus 26, contributes to costreduction.

[0043] The reservoir 24 and the waste liquid relay section 50 aregenerally comprised of a tank. They are, however, not limited to acontainer type. For example, it is possible to use a facility having arelay function, comprised of a pipeline and a value.

[0044]FIG. 3 shows a plating solution supply and recovery facility 40 baccording to yet another embodiment of the present invention. Theplating solution supply and recovery facility 40 b of this embodimentdiffers from the facility shown in FIG. 2 in that a so-called base bathis used as a fresh plating solution (fresh liquid) held in the carry-incontainer (fresh liquid drum) 32, and a chemical component, for examplean additive, is supplied (added) from a liquid component replenishmentapparatus 52, which is installed in the plating solution supply andrecovery facility 40 b, to the plating solution (fresh liquid) in thefresh liquid supply section 42, thereby preparing a plating solutionhaving a predetermined (desired) composition.

[0045] According to this embodiment, taking a copper sulfate platingsolution as an example, chemical components, such as a suppressor, anaccelerator and an inhibitor, are supplied from the liquid componentreplenishment apparatus 52 to a fresh liquid (base bath) in the freshliquid supply section 42 to thereby mix the chemical components into thebase bath, thereby preparing a plating solution having a predetermined(desired) composition. The concentration of a chemical component in theplating solution to be supplied to the reservoir 24 can thus be adjustedas desired. This makes it possible to respond flexibly to a componentadjustment or a change of chemical component in a plating solution, forexample, when the composition of the plating solution must be changedwith a change in the specifications of a substrate to be produced. Theliquid component replenishment apparatus 52 includes a plurality ofliquid component replenishment sections 54 corresponding to chemicals tobe added to a fresh plating solution (base bath).

[0046] A particular component, such as an additive, contained in aplating solution (electrolytic solution) is usually a chemical agent,such as an inhibitor, and is generally used in a minute amount on theorder of ppb to ppm. In the production of embedded interconnects in theLSI manufacturing field, it is necessary to embed an interconnectmaterial, such as copper, by plating in interconnect trenches having awidth of e.g. not more than 0.10 μm. The requirement for theconcentration accuracy of a chemical component in a plating solution foruse in such interconnect embedding is becoming strict. For example, anaccuracy of about ±3% relative to a predetermined concentration ispermitted for a chemical component in a plating solution for use inconventional electrolytic apparatuses, whereas an accuracy of not morethan 0.5% is required in the field of ultrafine LSI. This is becauseeven such a small change in the concentration of a chemical componentcan produce a significant difference in the metal processing accuracyupon processing of fine interconnects. In the case of forming embeddedinterconnects by copper plating, for example, the copper embeddingproperties of a plating solution for interconnects of less than 0.1 μmbecome unstable when the concentration accuracy of a chemical componentin the plating solution is over 0.5%, leading to the formation of voidsin the interconnects.

[0047] Metering means widely used for metering a liquid include a flowmeter, a metering pump, a mass flowmeter, a load cell (gravimetricmethod), etc. With such an existing means (device), however, it isgenerally difficult to meet the above-described concentration accuracyrequirement for a chemical compound. According to this embodiment,therefore, the liquid component replenishment sections 54 of the liquidcomponent replenishment apparatus 52 have the below-describedconstruction.

[0048]FIG. 4A shows an example of the liquid component replenishmentsection 54. The liquid component replenishment section 54 according tothis example includes a level meter 60 for metering the level of asupplementary chemical component 56, for example an inhibitor, stored ina storage container 58 such as a replenisher bottle, a total amountmetering device 62, for example composed of a load cell, for meteringthe total amount of the chemical component 56 in the storage container(replenisher bottle) 58, and a dose metering device 68, for examplecomposed of a load cell, for metering the amount (dose) of the chemicalcomponent 56 which has been transferred from the storage container 58into a dose metering container 66 by a pump 64 and is to be supplied toa plating solution.

[0049] By thus providing the dose metering device 68 which has anappropriate measurement range that meets an amount (dose) of a chemicalcomponent to be replenished (added), accurately metering a small amountof the chemical component (replenisher) 56 in the dose meteringcontainer 66 with the dose metering device 68 and adding (supplying) themetered amount of replenisher to the plating solution in the freshliquid supply section 42, it becomes possible to supply (add) thechemical component 56 in such an amount that meets he concentrationaccuracy requirement of e.g. within 0.5%, even when the amount is verysmall, for example on the order of ppb to ppm.

[0050] After supplying the chemical component 56 from the dose meteringcontainer 66 to the plating solution in the fresh liquid supply section42, the plating solution may be recycled into the dose meteringcontainer 66 for cleaning so that the chemical remaining on the innerside surface or the bottom of the dose metering container 66 or in aconnecting pipe or the like can be fully supplied to the fresh liquidsupply section 42. To make assurance of double sure, it is possible tofurther clean the dose metering container 66 with e.g. pure water sothat the chemical still adhering to e.g. the inner surface of the dosemetering container 66 is caused to flow into the fresh liquid supplysection 42.

[0051] The total amount metering device 62 and the level meter 60 arenecessary to detect the timing for a change of the storage container 58.The storage container 58 and the dose metering container 66 may notnecessarily be provided one for one. Thus, a liquid may be transferredfrom one storage container 58 to a plurality of dose metering containers66, or adversely, a liquid may be transferred from a plurality ofstorage containers 58 to one dose metering container 66.

[0052]FIG. 4B shows another example of the liquid componentreplenishment section 54 which employs a volumetric method to enhancethe metering accuracy. A liquid can be metered with high accuracy byusing a measuring cylinder or flask. There is, however, a difficulty inthe automation of such a method. According to this example, a measuringflash 70 having a narrow cylinder portion 70 a is used in combinationwith an optical sensor 72 which detects the surface the chemicalcomponent 56 in the narrow cylinder portion 70 a, to make up a dosemetering device for metering a dose of the chemical component 56 whichhas been transferred into the measuring flask 70 and is to be supplied(added) to the plating solution.

[0053]FIG. 4C shows yet another example of the liquid componentreplenishment section 54. According to this example, a high-accuracyvolumetric pump 74 of a pulse-count type is employed as a dose meteringdevice. Thus, the chemical component 56 stored in the storage container58 is supplied (added) directly to the plating solution in the freshliquid supply section 42 by the pump 74 as the dose metering device.Hicera pump manufactured by IWAKI Co., Ltd., for example, may be used asthe pump (dose metering device) 74.

[0054]FIG. 5 shows an electroplating system provided with a platingsolution supply and recovery facility 40 c according to yet anotherembodiment of the present invention. The electroplating system of thisembodiment includes three electroplating apparatuses 12, each being thesame as shown in FIG. 1 except for not having the liquid componentreplenishment apparatus 26 nor the plating solution analyzer 28,arranged in parallel, and a single plating solution supply and recoveryfacility 40 c for supplying a plating solution to the reservoir 24 ofeach electroplating apparatus 12 and recovering the used platingsolution from the reservoir 24. The electroplating apparatus 12 may ofcourse be provided in any desired numbers.

[0055] By providing a plurality of electroplating apparatuses 12, anincrease in the production amount of e.g. a substrate can be dealt with.The increase in the number of electroplating apparatuses 12 entails anincrease in the amount of the plating solution supplied to and recoveredfrom the electroplating apparatuses 12. For example, in anelectroplating system which uses a plating solution withoutreplenishment of a component, provision of ten electroplatingapparatuses 12 necessitates carrying-in and carrying-out of a platingsolution in an amount of about 10 to 20 m³ per month. When using a 200 Ldrum, it is necessary to move at least five drums every day, forexample, by using a drum carrier. This increases the cost and theworkload of the workers. A cost reduction by the increase in the amountof plating solution used will therefore be offset.

[0056] The plating solution supply and recovery facility 40 c of thisembodiment is so constructed that mass carrying-in and mass carrying-outof a plating solution using a mass transport means, for example atanker, is possible. In particular, according to this embodiment, theplating solution supply and recovery facility 40 c includes a freshliquid storage section 82, for example comprised of a tank, for storinga fresh plating solution (fresh liquid) which has been carried in bye.g. a tanker 80, and the above-described fresh liquid supply section42, for example comprised of a tank, connected to the fresh liquidstorage section 82 via a fresh liquid introduction line 84 therein. Thefresh liquid introduction line 84 is provided with a filter 86. Thefresh liquid supply section 42 and the reservoir 24 of eachelectroplating apparatus 12 are connected by the plating solution supplyline 36. The plating solution supply and recovery facility 40 c alsoincludes the above-described waste liquid recovery section 44, forexample comprised of a tank, for recovering the used plating solution(waste liquid) from the reservoir 24 of each electroplating apparatus 12and storing the plating solution, and a waste liquid storage section 90,for example comprised of a tank, which is connected to the waste liquidrecovery section 44 via a waste liquid introduction line 88, and storesthe waste liquid which has been transferred from the waste liquidrecovery section 44 and is to be carried to the outside. The platingsolution discharge line 38 and the fresh liquid supply section 42 areconnected by a plating solution recycling line 94 having a shut-offvalve 92 a interposed therein. A shut-off valve 92 b is interposed inthe plating solution discharge line 38 downstream of the junctionbetween the plating solution discharge line 38 and the plating solutionrecycling line 94.

[0057] The electroplating system of this embodiment, as with theabove-described system shown in FIG. 2, uses a plating solution withoutreplenishment of a component. The electroplating system of thisembodiment employs, as a fresh plating solution (fresh liquid) that iscarried in the fresh liquid storage section 82 e.g. by a tanker 80, aplating solution comprising a base bath premixed with a supplementarycomponent (s), such as an additive, thereby omitting the liquidcomponent replenishment apparatus 26 shown in FIG. 1 and also theplating solution analyzer 28 shown in FIGS. 1 and 2. The platingsolution (waste liquid) after use in plating is recovered in the wasteliquid recovery section 44, and then flows into the waste liquid storagesection 90, and is finally carried out in a mass e.g. by a tanker 80.

[0058] With the provision of the filter 86 in the fresh liquidintroduction line 84, particles contained in the plating solution can beremoved by the filter 86 upon transfer of the plating solution from thefresh liquid storage section 82 to the fresh liquid supply section 42.The removal of particles is particularly effective for the production ofan LSI.

[0059] Further, the provision of the plating solution recycling line 94,through the operation of the shut-off valves 92 a, 92 b, enables switchbetween discharge of the plating solution and circulation of the platingsolution between the reservoir 24 of each electroplating apparatus 12and the fresh liquid supply section 42, i.e., switch between recyclingand one-pass use of the plating solution, selectively.

[0060] The electroplating system of this embodiment can respond to anincrease in the production amount of e.g. a substrate by increasing thenumber of electrolytic processing apparatuses 12. Further, theelectroplating system can avoid the need to stop the apparatuses andenables mass carrying of a plating solution in and out of the platingsolution supply and recovery facility 40 c by e.g. a tanker 80. Thisreduces the workload of the plating solution which must be consumed in alarger amount due to the increased number of electroplating apparatuses12.

[0061]FIG. 6 shows an electroplating system provided with a platingsolution supply and recovery facility 40 d according to yet anotherembodiment of the present invention. The plating solution supply andrecovery facility 40 d of this embodiment differs from the facilityshown in FIG. 5 in the following respects: According to this embodiment,as with the facility shown in FIG. 3, a so-called base bath is used as afresh plating solution (fresh liquid) which is carried in the freshliquid storage section 82 by e.g. a tanker 80. The plating solutionsupply and recovery facility 40 d of this embodiment is provided withthe plating solution analyzer 28 for sampling and analyzing the platingsolution in the fresh liquid supply section 42. Further, a chemicalcomponent, for example an additive, is supplied (added) from the liquidcomponent replenishment apparatus 26 (or the liquid componentreplenishment apparatus 52 shown in FIG. 3), which is installed in theplating solution supply and recovery facility 40 d, to the platingsolution (fresh liquid) in the fresh liquid supply section 42, therebypreparing a plating solution having a predetermined (desired)composition.

[0062] According to this embodiment, as with the facility shown in FIG.3, chemical components, such as a suppressor, an accelerator and aninhibitor, are supplied from the liquid component replenishmentapparatus 52 (26) to the fresh liquid (base bath) in the fresh liquidsupply section 42 to thereby mix the chemical components into the basebath, thereby preparing a plating solution having a predetermined(desired) composition.

[0063]FIG. 7 shows an electroplating system provided with a platingsolution supply and recovery facility 40 e according to yet anotherembodiment of the present invention. The electroplating system of thisembodiment differs from the system shown in FIG. 5 in that in the formersystem, as in the system shown in FIG. 1, each electroplating apparatus12 is provided with the plating solution analyzer 28 and the liquidcomponent replenishment apparatus 26 (or the liquid componentreplenishment apparatus 52 shown in FIG. 3) so that the system can useplating solutions having various compositions. Using plating solutionswith varied or adjusted compositions according to the specifications ofe.g. substrates is necessary to satisfy the diversifying performancerequirements of users. The system of this embodiment, despite the needfor the plurality of plating solution analyzers, can achieve a costreduction by the centered supply of base bath, and can also satisfy therequirement for diversification of liquid composition.

[0064] A plating solution (electrolytic solution) supply and recoveryfacility according to the present invention is not necessarily anintegrated supply and recovery facility, but may be a combination ofseparate facilities.

[0065] As described hereinabove, the present invention enables a changeof a carry-in container (fresh liquid drum) or a carry-out container(waste liquid drum) without a stop of an associated electrolyticprocessing apparatus, i.e. without a time-lag due to the stop of theapparatus. Further, the present invention, in response to an increase inthe production amount of an associated electrolytic processingapparatus, can achieve an efficient supply and recovery of anelectrolytic solution while enhancing the productivity and lowering theproduction cost.

[0066] Although certain preferred embodiments of the present inventionhave been shown and described in detail, it should be understood thatvarious changes and modifications may be made therein without departingfrom the scope of the appended claims.

What is claimed is:
 1. An electrolytic solution supply and recoveryfacility for supplying and recovering an electrolytic solution to andfrom an electrolytic processing apparatus, comprising: a fresh liquidsupply section for storing a fresh electrolytic solution, saidelectrolytic solution having been transferred from a carry-in containerthat has been carried in from the outside, and for supplying the freshelectrolytic solution to the electrolytic processing apparatus; and awaste liquid recovery section for recovering the electrolytic solutionfrom the electrolytic processing apparatus, storing the electrolyticsolution and transferring the electrolytic solution to a carry-outcontainer which is to be carried to the outside.
 2. The electrolyticsolution supply and recovery facility according to claim 1, furthercomprising: a liquid component replenishment apparatus for replenishingthe electrolytic solution in the fresh liquid supply section with apredetermined chemical component.
 3. An electrolytic solution supply andrecovery facility for supplying and recovering an electrolytic solutionto and from a plurality of electrolytic processing apparatuses,comprising: a fresh liquid storage section for storing a freshelectrolytic solution which has been carried in from the outside; afresh liquid supply section for storing the fresh electrolytic solutionwhich has been transferred from the fresh liquid storage section andsupplying the fresh electrolytic solution to each of the plurality ofelectrolytic processing apparatuses; a waste liquid recovery section forrecovering the electrolytic solution from each of the plurality ofelectrolytic processing apparatuses and storing the electrolyticsolution; and a waste liquid storage section for storing theelectrolytic solution which has been transferred from the waste liquidrecovery section and is to be carried to the outside.
 4. Theelectrolytic solution supply and recovery facility according to claim 3,wherein each of the plurality of electrolytic processing apparatuses isprovided with an electrolytic solution analyzer for analyzing theelectrolytic solution which has been supplied to the electrolyticprocessing apparatus, and a liquid component replenishment apparatus forreplenishing the electrolytic solution with a chemical component basedon the results of analysis by the electrolytic solution analyzer.
 5. Theelectrolytic solution supply and recovery facility according to claim 3,wherein the fresh liquid storage section and the fresh liquid supplysection are connected by a line provided with a filter.
 6. Theelectrolytic solution supply and recovery facility according to claim 5,wherein each of the plurality of electrolytic processing apparatuses isprovided with an electrolytic solution analyzer for analyzing theelectrolytic solution which has been supplied to the electrolyticprocessing apparatus, and a liquid component replenishment apparatus forreplenishing the electrolytic solution with a chemical component basedon the results of analysis by the electrolytic solution analyzer.
 7. Theelectrolytic solution supply and recovery facility according to claim 3,wherein the electrolytic solution circulates between the fresh liquidsupply section and each of the plurality of electrolytic processingapparatuses.
 8. The electrolytic solution supply and recovery facilityaccording to claim 7, wherein each of the plurality of electrolyticprocessing apparatuses is provided with an electrolytic solutionanalyzer for analyzing the electrolytic solution which has been suppliedto the electrolytic processing apparatus, and a liquid componentreplenishment apparatus for replenishing the electrolytic solution witha chemical component based on the results of analysis by theelectrolytic solution analyzer.
 9. The electrolytic solution supply andrecovery facility according to claim 7, wherein the fresh liquid storagesection and the fresh liquid supply section are connected by a lineprovided with a filter.
 10. The electrolytic solution supply andrecovery facility according to claim 9, wherein each of the plurality ofelectrolytic processing apparatuses is provided with an electrolyticsolution analyzer for analyzing the electrolytic solution which has beensupplied to the electrolytic processing apparatus, and a liquidcomponent replenishment apparatus for replenishing the electrolyticsolution with a chemical component based on the results of analysis bythe electrolytic solution analyzer.
 11. A liquid component replenishmentapparatus for metering a predetermined chemical component andreplenishing an electrolytic solution with the chemical component,comprising: a total amount metering device for metering the total amountof a supplementary chemical component stored in a storage container; anda dose metering device for metering a dose of the chemical component tobe transferred and supplied from the storage container to theelectrolytic solution.
 12. The liquid component replenishment apparatusaccording to claim 11, wherein the metering devices employ a gravimetricmethod.
 13. The liquid component replenishment apparatus according toclaim 11, wherein the metering devices employ a volumetric method.